Combining MEMS Sensors and Wireless Technology: Realizing Monitoring of Building Structures

According to reports, Japan’s Daesung Construction Group recently announced the development of a building structure monitoring system in cooperation with Yokogawa Electric, Nagano Japan Wireless Co., Ltd. and the University of Tokyo. Through the newly developed high-precision MEMS (Micro Electro Mechanical Systems) sensors, combined with wireless technology in the 920 MHz band, long-term structural stability monitoring can be achieved.

The building structure monitoring system developed this time (Source: Japan Dacheng Construction Group)

Although the aging of social infrastructure such as bridges and buildings has become one of the major issues of concern to the Japanese government, with the cooperation of industry, academia, and government, the human resources and technology R&D required to maintain these infrastructure structures is rapidly being implemented. . The system developed this time was developed as part of the NEDO (Japan's new energy industry technology comprehensive development organization) commissioned project (a social task system R&D project such as infrastructure maintenance and renewal). Yokogawa Electric is a supplier of high-accuracy MEMS sensors, and Nagano Japan Wireless Co., Ltd. is a provider of wireless communication technology in the 920-MHz frequency band. Japan's Daesung Construction Group and the University of Tokyo are responsible for the assessment of the structural integrity of buildings.

Newly developed MEMS sensors are used in the building structure monitoring system: the resolution of the vibration sensor is 1mgal (Note: 1gal=1cm/s^2), and the resolution of the strain sensor is 1nm, which is longer than the traditional sensor maintenance cycle. It can accurately measure the small deformation and vibration generated in the structure over a long period of time.

The monitoring data obtained from the MEMS sensors is transmitted in the 920 MHz band (which is hardly affected by structures such as walls and ceilings in buildings). The sensor data is collected in receiving devices installed on each floor and transmitted to the diagnostic computer (PC), which can reduce the wiring work of the building structure. Furthermore, in order to install a monitoring system where power cannot be used, an independent power supply device is currently being developed.

In a diagnostic computer (PC), a structural integrity assessment system "T-iAlert Structure" is run. It analyzes the natural frequency, distortion, and tilt angle of the structure based on the measurement data acquired by the MEMS sensor and monitors the change in structure over time over time. When an earthquake of magnitude 3 or higher occurs, a sound diagnosis is made based on the vibrations that occur in the structure of the building. When an abnormal situation is diagnosed, a secondary injury site diagnosis can be performed.

In 2018, Japan Dacheng Construction Group will accumulate experimental experience on existing buildings, civil engineering structures, etc. At the same time, from the analysis results of the system, the building BCP (business continuity plan) measures will be proposed. From April 2019, Japan Dacheng Construction Group hopes to fully implement the deployment of the system.


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