The requirements for molds in the semiconductor packaging mold industry are as follows: First, the requirements for finishing molds, the current electronic products are continuously integrated and miniaturized, the products tend to be high-end, the size is getting smaller and smaller, and the package is getting thinner and thinner. The higher the quality, the higher the precision of the mold.
The plastic mold process is one of the most important process methods in the post-process production of semiconductor devices. It is generally applied to single-cylinder packaging technology, and its package includes DI P, SOP, QFP, SOT, SOD, TR discrete devices and chip tantalum capacitors. Inductors, bridge circuits and other products.
Packaging technology is constantly evolving. The chip size is reduced, the ratio of chip area to package area is closer to 1, the number of I/Os is increased, and the pitch of pins is reduced. The development of packaging technology is inseparable from advanced electronic tooling equipment, multi-injection mold packaging (MGP), automatic die-cutting system, automatic packaging system and other high-tech new products to meet this demand, Sanjia also launched these product.
Multi-injection head package (MGP) is an extension of single-cylinder mold technology and is the mainstream product of today's packaging molds. The utility model adopts a multi-barrel and multi-injection head package form, and has the advantages that the flow channel can be balanced, the near-distance filling is realized, the Resin utilization rate is high, the packaging process is stable, and the product packaging quality is good. It is suitable for SSOP, TSS OP, LQFP and other multi-row, small pitch, high-density integrated circuits and SOT, SOD and other micro-semiconductor device package.
The automatic die cutting system is an automated device for forming integrated circuits and semiconductor devices. High-speed, multi-functional, and versatile is the development direction of the system, which can meet the molding of various lead frame carriers.
In the future, the development direction of semiconductor packaging molds is to develop packaging molds with higher precision and higher speed---automatic packaging molds. The automatic plastic sealing system is a high-precision, high-automatic equipment for the post-process packaging of integrated circuits. A plurality of plastic sealing working units are arranged in the system, and a modular MGP mode is installed in each unit, and a plurality of units are packaged in the order of preparation, and the whole machine is assembled, loaded, packaged, unloaded, cleaned, glued, and collected. In one. The technology has developed rapidly in foreign countries, and technologies such as film covering and packaging, and plastic packaging have appeared, which can meet the packaging of various high-density and high-lead products.
With the rapid development of microelectronics technology, the application technology of semiconductor post-sealing molding equipment has been continuously improved, and automation has become an inevitable trend. As the first listed company in the mold industry in China, Sanjia will focus on the world's advanced technology and accelerate the localization of electronic molds.
The plastic mold process is one of the most important process methods in the post-process production of semiconductor devices. It is generally applied to single-cylinder packaging technology, and its package includes DI P, SOP, QFP, SOT, SOD, TR discrete devices and chip tantalum capacitors. Inductors, bridge circuits and other products.
Packaging technology is constantly evolving. The chip size is reduced, the ratio of chip area to package area is closer to 1, the number of I/Os is increased, and the pitch of pins is reduced. The development of packaging technology is inseparable from advanced electronic tooling equipment, multi-injection mold packaging (MGP), automatic die-cutting system, automatic packaging system and other high-tech new products to meet this demand, Sanjia also launched these product.
Multi-injection head package (MGP) is an extension of single-cylinder mold technology and is the mainstream product of today's packaging molds. The utility model adopts a multi-barrel and multi-injection head package form, and has the advantages that the flow channel can be balanced, the near-distance filling is realized, the Resin utilization rate is high, the packaging process is stable, and the product packaging quality is good. It is suitable for SSOP, TSS OP, LQFP and other multi-row, small pitch, high-density integrated circuits and SOT, SOD and other micro-semiconductor device package.
The automatic die cutting system is an automated device for forming integrated circuits and semiconductor devices. High-speed, multi-functional, and versatile is the development direction of the system, which can meet the molding of various lead frame carriers.
In the future, the development direction of semiconductor packaging molds is to develop packaging molds with higher precision and higher speed---automatic packaging molds. The automatic plastic sealing system is a high-precision, high-automatic equipment for the post-process packaging of integrated circuits. A plurality of plastic sealing working units are arranged in the system, and a modular MGP mode is installed in each unit, and a plurality of units are packaged in the order of preparation, and the whole machine is assembled, loaded, packaged, unloaded, cleaned, glued, and collected. In one. The technology has developed rapidly in foreign countries, and technologies such as film covering and packaging, and plastic packaging have appeared, which can meet the packaging of various high-density and high-lead products.
With the rapid development of microelectronics technology, the application technology of semiconductor post-sealing molding equipment has been continuously improved, and automation has become an inevitable trend. As the first listed company in the mold industry in China, Sanjia will focus on the world's advanced technology and accelerate the localization of electronic molds.
Properties:
Oxalic ACID is white crystal. Its melting point is 101-102 °C and sublimes at 157 °C.It is soluble in water,alcohol and ethyl ether. It is insoluble in benzene and chloroform. It is toxic. Pharmaceutical industry: for ring elements. Oxytetracycline. Borneol etc.;
Application:
1.Purifying agent in pharmaceutical industry, special in antibiotic medication, such as oxytetracycline,Chloramphenicol etc.
2.Precipitating agent in Rare-earth mineral processing.
3.Bleaching agent in the textile activities, wood pulp bleaching.
4.Rust-remover for metal treatment.
5.Grinding agent, such as marble polishing.
6.Waste Water Treatment, removing calcium from water.
Oxalic Acid,Oxalic Acid Crystals,Hydrated Oxalic Acid,Crystalline Oxalic Acid
HENAN JINHE INDUSTRY CO.,LTD , https://www.hnchromiumoxidegreen.com