University of California Research Silicon Board: Increased Processor Speed

On January 12th, the well-known researcher Cen Yingxi described many novel ideas in science and technology, such as "Cold thinking, revitalizing computing science and technology", such as cold quantum neurons, calculating with wires, attacking nano droplets, silicon circuit boards, etc. .

Nicknamed, computer designers are all exploring why the movement of data within the chip is so easy, and the movement between chips is much slower and more laborious. According to engineers at the University of California, Los Angeles (UCLA), it is due to problems with chip packaging and printed circuit boards. None of them are good thermal conductors, which limits the amount of energy allowed to dissipate. They also increase the amount of energy and time required to move digitally between chips. For this reason, the industry has seen these problems, and began to package multiple chips together.

Puneet Gupta and his UCLA colleagues recommend replacing a traditional printed circuit board with a small silicon circuit board. On such a "silicon chip", unpackaged bare chips can be constricted within 100 microns and connected by the same wiring as integrated circuits, reducing latency, power consumption, and system size.

This approach helps to break the expensive system-on-chip (SOC) and replace it with cheap chiplets, allowing the chipset to perform various core functions on the SOC. In addition, because silicon conducts heat better than printed circuit boards, you can run processor cores at higher speeds.


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